Advantages: high assembly density, small size and light weight. Due to the high assembly density, the wiring between components (including components) is reduced, thereby improving reliability; the number of wiring layers can be increased, thereby increasing design flexibility; A circuit with a certain impedance is formed; a high-speed transmission circuit can be formed; a circuit, magnetic circuit shielding layer can be set, and a metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation; simple installation and high reliability.

Disadvantages: high cost; long cycle; high-reliability testing methods are required. Multilayer printed circuit is the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and very large-scale integrated circuits, multilayer printed circuits are rapidly developing in the direction of high density, high precision, and high-level digitalization. Fine lines and small apertures have appeared. , Blind and buried holes, high plate thickness to aperture ratio and other technologies to meet the needs of the market.