YHD Electronics Limited is committed to providing proofing/medium and small batch services for global R&D and innovative enterprises, with 2~30 layers of high TG boards, high frequency boards, HDI boards, thick copper boards, FPC boards, flexible and rigid boards, and a wide range of products from samples to batches. Used in industrial control, communications, new energy, automobiles, medical equipment, security, aerospace and other fields
1. Do a backlight test after copper sinking to ensure the adhesion of the copper hole
2. After etching, do a slice analysis to ensure the thickness of the hole copper and the thickness of the surface copper
3. AOI optical scanning to ensure the straight-through rate of the line (to prevent open circuit and short circuit)
4. High-speed screw flying needle machine test to ensure yield
5. The solder mask is exposed by LED parallel exposure machine
6. High-precision laser text printing to ensure text clarity and accuracy
| Project name | Process capability |
| Number of layers | 2-30 layers |
| Material | FR4, high-frequency sheet, PTFE, aluminum-based, silver-based, thick copper foil, halogen-free surface material, Arlin, Rogers, cem-1, cem-3 mixed media compression, flexible board, flexible board |
| biggest size | 650mm*1130mm |
| Tolerance | ±0.10mm |
| 0.2mm-6.0mm | |
| ±10% | |
| Minimum line width and line spacing | 0.075mm |
| Copper thickness | 18um-210um (HOZ-6OZ ) |
| Drill mouth size | 0.15mm-6.50mm |
| Cheng Nanhong | 0.1mm-6.0mm |
| Sub-base ^ position tolerance | ±0.05mm |
| Minimum solder mask bridge | ±0.05mm |
| Stop Confucius | 0.20mm-0.50mm |
| Solder mask color | Green, blue, white, black, red, yellow, purple, etc. |
| Surface treatment | Tin spraying, spraying pure tin, immersed gold, immersed tin, immersed silver, epoxidized, hard gold plating (up to 100u") |
The factory is located in Shiyan, Shenzhen, and has set up an office in Changsha, focusing on research and development of proofing, small and medium batch SMT patches, post welding, assembly, and testing services.
· SMT production lines: 5 SMT production lines with a plant area of 2500 square meters
· High-end equipment: SM482 PLUS / SM481 PLUS /AOI/XRAY / dual-segment wave soldering / eight-temperature zone reflow soldering
· Full BOM material supply: tens of thousands of resistance and capacitance are in the warehouse
· Fast delivery: the fastest delivery in 8 hours, the delivery rate in 36 hours exceeds 95%
· Minimum placement: 01005, 0201
Minimum BGA ball pitch: 0.25 MMM
| Material type | Options | The smallest | maximum |
| PCB | Dimensions (length, width and thickness mm) | 50*40*0.38 | 600*400*4.2 |
| weight | 1.8KG | ||
| Special size | 1200*400*4.2 | ||
| element | Chip and IC | 0201（0.5*0.25） | 55mm |
| BGA pitch | 0.3 | ||
| QFP pitch | 0.3 | ||
| Parts placement accuracy (100FP) | Mounting accuracy is up to ±50 microns, and repeatability is up to ±30 microns | ||
| Processing type | merchandise quantity | Patch points | Normal delivery | Shortest delivery time |
| SMT | 5~200 | <70,000 points | 2 days | 8 hours |
| 201~2000 | <150,000 points | 3-5 days | 2 days | |
≥2000 | <300,000 points | 5 days | 3 days | |
| SMT+DIP | 5~200 | <70,000 points | 3-4 days | 2 days |
| 201~2000 | <150,000 points | 4-7 days | ||
| ≥2000 | <150,000 points | 6-9 days | ||
| Average daily production capacity | 5 million points (SMT) | 100,000 points (DIP) | ||
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